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Soldering Processes and Equipment

Angebote / Angebote:

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances.
Folgt in ca. 15 Arbeitstagen

Preis

201,00 CHF