Quality Conformance and Qualification of Microelectronic Packages and Interconnects

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All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don't cost-effectively address potential failure mechanisms or the manufacturing processes of the product. It has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, quality screens, and tests. This book's groundbreaking, science-based approach to developing qualification and quality assurance programs helps engineers reach a new level of reliability in today's high-performance microelectronics. It does this with powerful techniques for identifying and modeling failure mechanisms earlier in the design cycle, breaking the need to rely on field data, physics-of-failure product reliability assessment methods that can be proactively implemented throughout the design and manufacture of the product, and process controls that decrease variabilities in the end product and reduce end-of-line screening and testing. A wide range of microelectronic package and interconnect configurations for both single- and multi-chip modules is examined, including chip and wire-bonds, tape-automated (TAB), flip-TAB, flip-chip bonds, high-density interconnects, chip-on-board designs (COB), MCM, 3-D stack, and many more. The remaining package elements, such as die attachment, case and lid, leads, and lid and lead seals are also discussed in detail. The product of a distinguished team of authors and editors, this book's guidelines for avoiding potentialhigh-risk manufacturing and qualification problems, as well as for implementing ongoing quality assurance, are sure to prove invaluable to both students and practicing professionals.