Chemical-Mechanical Planarization of Semiconductor Materials

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This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

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Artikelnummer 9783642077388
Autor Oliver, M.R.
Einband C, Characterization and Evaluation of Materials, Electronics and Microelectronics, Instrumentation, Manufacturing, Machines, Tools, Processes, Physical Chemistry, Surfaces and Interfaces, Thin Films, Optical and Electronic Materials, Characterization and Analytical Technique, Machines, Tools, Processes, Surfaces, Interfaces and Thin Film, Optical Materials, Chemistry and Materials Science, Materials science, Electronics, Microelectronics, Manufactures, Materials—Surfaces, Thin films, Electronic materials, Electronics engineering, Production engineering, Surface chemistry & adsorption, Electronic devices & materials, Kartonierter Einband (Kt)
Sprache eng
Anzahl Seiten 428
Verlag Springer Nature EN
Reihe Springer Series in Materials Science
Jahr 2010

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