3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
BücherAngebote / Angebote:
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
* Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
* Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
* Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
* Provides chapter-wise review questions and powerpoint slides as teaching tools
Lieferbar in ca. 10-20 Arbeitstagen